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您查询的相关hs编码 15 条,您的查询关键词 单晶硅
| HS编码 | 品名 | 实例汇总 | 申报要素·退税 | 编码比对 |
|---|---|---|---|---|
| 38180011.00
(已作废)
推荐查询: 38180011 |
7.5cm≤直径≤15.24cm单晶硅片
(7.5cm≤直径≤15.24cm单晶硅片经掺杂用于电子工业的) [Monocrystalline sillicon, in the form of discs, wafers or similar form, diameter 7.5cm or more but not exceeding 15.24cm, chemical compounds doped for use in electronics] |
102条 | 查看详情 | -- |
| 38180019.00
(已作废)
推荐查询: 38180019 |
直径〉15.24cm的单晶硅片
(直径〉15.24cm的单晶硅片经掺杂用于电子工业的) [Monocrystalline sillicon, in the form of discs, wafers or similar form, diameter exceeding 15.24cm, chemical compounds doped for use in electronics] |
35条 | 查看详情 | 对比-38180011.00 |
| 84861010.00 | 利用温度变化处理单晶硅的机器及装置
(利用温度变化处理单晶硅的机器及装置制造单晶柱或晶圆用的) [Machines and apparatus for the treatment of monocrystalline sillicon by a process involving a change of temperature (used for the manufacture of boules or wafers)] |
22条 | 查看详情 | 对比-38180019.00 |
| 28046119.00 | 电子工业用7.5cm≤直径＜30cm单晶硅棒
(电子工业用7.5cm≤直径＜30cm单晶硅棒按重量计含硅量不少于99.99%) [Monocrystals doped for use in electronics, in the form of cylinders or rods, 7.5cm or more, less than 30cm in diameter(containing by weight not less than 99.99% of silicon)] |
13条 | 查看详情 | 对比-84861010.00 |
| 28046120.00 | 电子工业用直径＜7.5cm单晶硅棒
(电子工业用直径＜7.5cm单晶硅棒按重量计含硅量不少于99.99%) [Monocrystals doped for use in electronics, in the form of cylinders or rods, less than 7.5cm in diameter(containing by weight not less than 99.99% of silicon)] |
10条 | 查看详情 | 对比-28046119.00 |
| 28046117.00 | 电子工业用直径≥30cm单晶硅棒
(电子工业用直径≥30cm单晶硅棒按重量计含硅量不少于99.99%) [Monocrystals doped for use in electronics, in the form of cylinders or rods, 30cm or more in diameter(containing by weight not less than 99.99% of silicon)] |
2条 | 查看详情 | 对比-28046120.00 |
| 38180015.90 (增) | 厚度在220微米及以下的其他经掺杂用于电子工业的单晶硅切片
(经掺杂用于电子工业的) [Other single crystal silicon slices doped for use in the electronics industry with a thickness of 220 micrometers or less] |
0条 | 查看详情 | 对比-28046117.00 |
| 38180014.90 (增) | 厚度在220微米 以上的其他经掺杂用于电子工业的单晶硅切片
(经掺杂用于电子工业的) [Other doped monocrystalline silicon wafers for electronic industry with a thickness of more than 220 microns] |
0条 | 查看详情 | 对比-38180015.90 |
| 38180014.20 (增) | 厚度在220微米 以上的经掺杂用于电子工业的单晶硅切片，直径在20.32厘米及以上，但小于30.48厘米
(经掺杂用于电子工业的) [Doped monocrystalline silicon wafers for electronic industry with a thickness of more than 220 microns, diameter of 20.32 cm or more but less than 30.48 cm] |
0条 | 查看详情 | 对比-38180014.90 |
| 38180014.10 (增) | 厚度在220微米 以上的经掺杂用于电子工业的单晶硅切片，直径超过15.24厘米，但小于20.32厘米
(经掺杂用于电子工业的) [Doped monocrystalline silicon wafers for electronic industry with a thickness of more than 220 microns, diameter exceeding 15.24 cm but less than 20.32 cm] |
0条 | 查看详情 | 对比-38180014.20 |
| 38180015.10 (增) | 厚度在220微米及以下的经掺杂用于电子工业的单晶硅切片，直径超过15.24厘米，但小于20.32厘米
(经掺杂用于电子工业的) [Doped monocrystalline silicon wafers for electronic industry with a thickness of 220 microns or less, diameter exceeding 15.24 cm but less than 20.32 cm] |
0条 | 查看详情 | 对比-38180014.10 |
| 38180015.20 (增) | 厚度在220微米及以下的经掺杂用于电子工业的单晶硅切片，直径在20.32厘米及以上，但小于30.48厘米
(经掺杂用于电子工业的) [Single crystal silicon slices doped for use in the electronics industry with a thickness of 220 micrometers or less, with a diameter of 20.32 cm or more but less than 30.48 cm] |
0条 | 查看详情 | 对比-38180015.10 |
| 38180019.90
(已作废)
推荐查询: 38180019 |
其他经掺杂用于电子工业的单晶硅切片
(其他经掺杂用于电子工业的单晶硅切片) [Other doped monocrystalline silicon slices used in the electronics industry] |
0条 | 查看详情 | 对比-38180015.20 |
| 38180019.10
(已作废)
推荐查询: 38180019 |
经掺杂用于电子工业的单晶硅切片，直径超过15.24厘米，但小于20.32厘米
(经掺杂用于电子工业的单晶硅切片，直径超过15.24厘米，但小于20.32厘米) [Single crystal silicon slices doped for the electronics industry, with a diameter exceeding 15.24 centimeters but less than 20.32 centimeters] |
0条 | 查看详情 | 对比-38180019.90 |
| 38180019.20
(已作废)
推荐查询: 38180019 |
经掺杂用于电子工业的单晶硅切片，直径在20.32厘米及以上，但小于30.48厘米
(经掺杂用于电子工业的单晶硅切片，直径在20.32厘米及以上，但小于30.48厘米) [Single crystal silicon slices doped for the electronics industry, with a diameter of 20.32 centimeters or more but less than 30.48 centimeters] |
0条 | 查看详情 | 对比-38180019.10 |