365外贸网
您查询的相关hs编码 11 条,您的查询关键词 848640
| HS编码 | 品名 | 实例汇总 | 申报要素·退税 | 编码比对 |
|---|---|---|---|---|
| 84864039.00 | 其他用于升降、装卸、搬运集成电路等的设备
(其他用于升降、装卸、搬运集成电路等的设备升降、装卸、搬运单晶柱、晶圆、半导体器件、集成电路和平板显示器的装置) [Other machines for lifting, handling, loading or unloading of electronic integrated circuits (apparatus used for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays)] |
228条 | 查看详情 | -- |
| 84864029.00 | 其他主要或专用于装配封装半导体器件和集成电路的设备
(其他主要或专用于装配封装半导体器件和集成电路的设备) [Other machines solely or principally of a kind used for assembling or encapsulating semiconductor devices or electronic integrated circuits] |
152条 | 查看详情 | 对比-84864039.00 |
| 84864021.00 | 塑封机
(塑封机主要用于或专用于装配与封装半导体器件和集成电路的设备) [Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)] |
52条 | 查看详情 | 对比-84864029.00 |
| 84864022.90
(已作废)
推荐查询: 84864022 |
其他引线键合装置
(其他引线键合装置(主要用于或专用于装配与封装半导体器件和集成电路的设备)) [Other types of lead bonding device (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)] |
29条 | 查看详情 | 对比-84864021.00 |
| 84864010.00 | 主要用于或专用于制作和修复掩膜版或投影掩膜版的装置
(主要用于或专用于制作和修复掩膜版或投影掩膜版的装置掩膜版(mask),投影掩膜版(reticle)) [Apparatus solely or principally of a kind used for the manufacture or repair of masks and reticles] |
19条 | 查看详情 | 对比-84864022.90 |
| 84864031.00 | IC工厂专用的自动搬运机器人
(IC工厂专用的自动搬运机器人) [Automated material handling machines solely or principally of a kind used in the electronic integrated circuits factories] |
16条 | 查看详情 | 对比-84864010.00 |
| 84864022.01
(已作废)
推荐查询: 84864022 |
全自动铝丝焊接机
(主要用于或专用于装配与封装半导体器件和集成电路的设) |
8条 | 查看详情 | 对比-84864031.00 |
| 84864022.20
(已作废)
推荐查询: 84864022 |
全自动铜丝焊接机
(全自动铜丝焊接机(主要用于或专用于装配与封装半导体器件和集成电路的设备)) [Full automatic wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuits equipment)] |
2条 | 查看详情 | 对比-84864022.01 |
| 84864022.00 | 引线键合装置
(引线键合装置主要用于或专用于装配与封装半导体器件和集成电路的设备) [Wire bonding device] |
0条 | 查看详情 | 对比-84864022.20 |
| 84864022.10
(已作废)
推荐查询: 84864022 |
全自动铝丝焊接机
(全自动铝丝焊接机(主要用于或专用于装配与封装半导体器件和集成电路的设备)) [Automatic aluminum foil welding apparatus(machines solely or principally of a kind used for assembling or encapsulating semiconductor devices or elctronic integrated circuits)] |
0条 | 查看详情 | 对比-84864022.00 |
| 84864022.30
(已作废)
推荐查询: 84864022 |
全自动金丝焊接机
(全自动金丝焊接机(主要用于或专用于装配与封装半导体器件和集成电路的设备)) [Full automatic gold wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuitsequipment)] |
0条 | 查看详情 | 对比-84864022.10 |
申报实例查询结果
| HS编码 | 商品名称 | 商品规格 |
|---|---|---|
| 84869010.00 | 升降、搬运、装卸机器用零件或附件 | 子目848640项下商品用,但自动搬运设备用除外 |
| 84869020.00 | 引线键合装置用零件或附件 | 子目848640项下商品用 |